The 6th generation Intel® Core™ processor family is manufactured on Intel's latest 14 nm technology. Paired with the Intel® 100 series chipset, these processors offer dramatically higher CPU and graphics performance as compared to the previous generation, a broad range of power options, and new advanced features to boost performance for edge-to-cloud Internet of Things (IoT) designs. The 6th generation Intel Core processor family maintains a standardized thermal envelope for 65W and 35W desktop products remaining consistent with the previous processor generation and are an ideal low-power option for manufacturing flexibility. The date of release and performance specification is shown in the table below.

"Skylake" (14 nm)

Skylake is the codename for the Intel® processor microarchitecture that is the successor to the Broadwell microarchitecture. Skylake is built on Intel’s 14 nm manufacturing process and delivers breakthroughs in performance and power efficiency over previous generation microarchitectures for high performance graphics, stunning high-resolution video playback, great system performance and responsiveness, even longer battery life, and stronger security. 

The major changes between the Haswell and Skylake architectures include the removal of the fully integrated voltage regulator (FIVR) introduced with Haswell. On the variants that will use a discrete Platform Controller Hub (PCH), Direct Media Interface (DMI) 2.0 is replaced by DMI 3.0, which allows speeds of up to 8 GT/s.

Architecture:

• Improved front-end, deeper out-of-order buffers, improved execution units, more execution units(third vector integer ALU(VALU)), more load/store bandwidth, improved hyper-threading (wider retirement), speedup of AES-GCM and AES-CBC by 17% and 33% accordingly.
• 14 nm manufacturing process
• LGA 1151 socket for desktop processors
• 100 Series chipset (Sunrise Point)
• Thermal design power (TDP) up to 95 W (LGA 1151)
• Support for both DDR3L SDRAM and DDR4 SDRAM in mainstream variants, using custom UniDIMM SO-DIMM form factor with up to 64 GB of RAM on LGA 1151 variants. Usual DDR3 memory is also supported by certain motherboard vendors even though Intel doesn't officially support it.
• Support for 16 PCI Express 3.0 lanes from CPU, 20 PCI Express 3.0 lanes from PCH (LGA 1151)
• Support for Thunderbolt 3 (Alpine Ridge)
• 64 to 128 MB L4 eDRAM cache on certain SKUs
• Up to four cores as the default mainstream configuration
• Intel MPX (Memory Protection Extensions)
• Intel SGX (Software Guard Extensions)
• Intel Speed Shift
• Skylake's integrated Gen9 GPU supports Direct3D 12 at the feature level 12_1
• Full fixed function HEVC Main/8bit encoding/decoding acceleration. Hybrid/Partial HEVC Main10/10bit decoding acceleration. JPEG encoding acceleration for resolutions up to 16,000×16,000 pixels. Partial VP9 encoding/decoding acceleration.